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Volumn 35, Issue 2 SUPPL. B, 1996, Pages 1531-1534
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Formation process of highly reliable ultra-thin gate oxide
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Author keywords
Active hydrogen; High reliability; Post oxidation annealing; Ultra thin oxide
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Indexed keywords
ANNEALING;
CHEMICAL BONDS;
ELECTRIC BREAKDOWN;
ELECTRIC FIELD EFFECTS;
ELECTRIC FIELDS;
ELECTRIC VARIABLES MEASUREMENT;
FILM GROWTH;
HYDROGEN;
OXIDES;
RELIABILITY;
ULTRATHIN FILMS;
ACTIVE HYDROGEN;
BREAKDOWN TEST;
CONSTANT CURRENT STRESS;
GATE VOLTAGE SHIFT;
HYDROGEN RADICAL BALANCED STEAM OXIDATION;
POST OXIDATION ANNEALING;
REDUCTIVE AMBIENT;
ULTRA THIN GATE OXIDE;
OXIDATION;
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EID: 0030080403
PISSN: 00214922
EISSN: None
Source Type: Journal
DOI: 10.1143/jjap.35.1531 Document Type: Article |
Times cited : (4)
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References (8)
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