SCOPUS 정보 검색 플랫폼

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 35, Issue 2 SUPPL. B, 1996, Pages 1054-1059

Ultrauniform chemical mechanical polishing (CMP) using a "hydro chuck", featured by wafer mounting on a quartz glass plate with fully flat, water-supported surface

(3) Hayashi, Yoshihiro a Nakajima, Tsutomu a Kunio, Takemitsu a

a NEC CORPORATION (Japan)

Author keywords

Chemical mechanical polishing; CMP apparatus; Interlayer dielectric film; Planarization; Shallow trench isolation

Indexed keywords

ABRASIVES; CHEMICAL VAPOR DEPOSITION; DIELECTRIC FILMS; INCLUSIONS; LENSES; SEMICONDUCTING POLYMERS; SILICA; SURFACES; WATER;

CHEMICAL MECHANICAL POLISHING; ELASTIC FILM; INTERLAYER DIELECTRIC FILM; OPTICAL LENS POLISHING TECHNIQUE; PLANARIZATION; QUARTZ GLASS PLATE; SHALLOW TRENCH ISOLATION; WAFER CHUCK STRUCTURE; WAFER MOUNTING;

CHEMICAL POLISHING;

EID: 0030078908 PISSN: 00214922 EISSN: None Source Type: Journal
DOI: 10.1143/jjap.35.1054 Document Type: Article

Times cited : (12)

References (8)

1
- 0028465918
- S. R. Runnels: J. Electrochem. Soc. 141 (1994) 1900.
- (1994) J. Electrochem. Soc. , vol.141 , pp. 1900
- Runnels, S.R.¹

2
- 4243143695
- Business Center for Academic Societies Japan, Tokyo
- S. Kishii, H. Horie, M. Hoko, Y. Arimoto and T. Ito: Ext. Abstr. 1993 Int. Conf. Solid State Devices and Materials (Business Center for Academic Societies Japan, Tokyo, 1993) p. 189.
- (1993) Ext. Abstr. 1993 Int. Conf. Solid State Devices and Materials , pp. 189
- Kishii, S.¹ Horie, H.² Hoko, M.³ Arimoto, Y.⁴ Ito, T.⁵

3
- 0029513729
- M. Norishima, T. Matsuno, M. B. Anand, M. Murota, M. Inohara, K. Inoue, H. Ohtani, K. Miyamoto, R. Ogawa, M. Seto, C. Fukuhara, H. Shibata and M. Kakumu: 1995 Symp. VLSI Technology Dig. (1995) p. 47.
- (1995) 1995 Symp. VLSI Technology Dig. , pp. 47
- Norishima, M.¹ Matsuno, T.² Anand, M.B.³ Murota, M.⁴ Inohara, M.⁵ Inoue, K.⁶ Ohtani, H.⁷ Miyamoto, K.⁸ Ogawa, R.⁹ Seto, M.¹⁰ Fukuhara, C.¹¹ Shibata, H.¹² Kakumu, M.¹³

4
- 0029484254
- K. Ueno, K. Ohto and K. Tsunenari: 1995 Symp. VLSI Technology Dig. Tech. Pap. (1995) p. 27.
- (1995) 1995 Symp. VLSI Technology Dig. Tech. Pap. , pp. 27
- Ueno, K.¹ Ohto, K.² Tsunenari, K.³

5
- 0028600433
- K. Ishimaru, H. Gojohbori, H. Koike, Y. Unno, M. Sai, F. Matsuoka and M. Kakumu: 1994 Symp. VLSI Technology Dig. Tech. Pap. (1994) p. 97.
- (1994) 1994 Symp. VLSI Technology Dig. Tech. Pap. , pp. 97
- Ishimaru, K.¹ Gojohbori, H.² Koike, H.³ Unno, Y.⁴ Sai, M.⁵ Matsuoka, F.⁶ Kakumu, M.⁷

6
- 3743149933
- Business Center for Academic Societies Japan, Tokyo
- Y. Homma, T. Furusawa, K. Kusukawa, S. Moriyama, H. Morishima and H. Sato: Ext. Abstr. 1995 Int. Conf. Solid State Devices and Materials (Business Center for Academic Societies Japan, Tokyo, 1995) p. 154.
- (1995) Ext. Abstr. 1995 Int. Conf. Solid State Devices and Materials , pp. 154
- Homma, Y.¹ Furusawa, T.² Kusukawa, K.³ Moriyama, S.⁴ Morishima, H.⁵ Sato, H.⁶

7
- 0029252380
- Y. Hayashi, M. Sakurai, T. Nakajima, K. Hayashi, S. Sasaki, S. Chikaki and T. Kunio: Jpn. J. Appl. Phys. 34 (1995) 1037.
- (1995) Jpn. J. Appl. Phys. , vol.34 , pp. 1037
- Hayashi, Y.¹ Sakurai, M.² Nakajima, T.³ Hayashi, K.⁴ Sasaki, S.⁵ Chikaki, S.⁶ Kunio, T.⁷

8
- 0025558401
- P. Renteln, M. E. Thomas and J. M. Pierce: Proc. VLSI Multilevel Interconnection Conf., Santa Clara, 1990, p. 57.
- Proc. VLSI Multilevel Interconnection Conf., Santa Clara, 1990 , pp. 57
- Renteln, P.¹ Thomas, M.E.² Pierce, J.M.³

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.