Technologies of joining between ITER reference grade beryllium and copper alloys by diffusion bonding process

Fusion Technology

Volumn 30, Issue 3, 1996, Pages 689-693

  Visca, Eliseo ^a   Pietro, Enrico Di ^a   Ceccotti, Giancarlo ^a   Mercurio, Giovanni ^a  

^a ENEA   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

BERYLLIUM ALLOYS; BONDING; COPPER ALLOYS; DIFFUSION; HEAT FLUX; HEAT RESISTANCE; INSPECTION; JOINING; SHEAR STRENGTH; THERMAL EFFECTS;

DIFFUSION BONDING; PLASMA FACING COMPONENTS;

FUSION REACTORS;

EID: 0030073907     PISSN: 07481896     EISSN: None     Source Type: None    
DOI: 10.13182/fst96-a11963016     Document Type: Article

References (4)