Application of Plasma Polymerized Methylsilane in an all dry resist process for 193 and 248 nm lithography

Microelectronic Engineering

Volumn 30, Issue 1-4, 1996, Pages 275-278

  Joubert, O ^a   Weidman, T W ^a   Joshi, A M ^a   Kostelak, R L ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHLORINE; ETCHING; INTEGRATED CIRCUIT MANUFACTURE; PHOTOCHEMICAL REACTIONS; PHOTORESISTS; PLASMA APPLICATIONS; PLASMAS; SILANES;

CHLORINE PLASMA ETCHING; DRY RESIST PROCESS; PLASMA POLYMERIZED METHYLSILANE;

PHOTOLITHOGRAPHY;

EID: 0029775430     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/0167-9317(95)00244-8     Document Type: Article

References (2)

1. A.M. Joshi, T.W. Weidman, J.T.C. Lee, G.N. Taylor, Proc. SPIE 2195, 358, (1994)
2. O. Joubert, T.W. Weidman, A.M. Joshi, , R. Cirelli, S. Stein, J.T.C. Lee, S. Vaidya, J.Vac.Sci.Technol. B12, 3909, (1994).