Principles of the development of a silica dielectric for microelectronics packaging

Journal of Materials Research

Volumn 11, Issue 1, 1996, Pages 243-263

  Gupta, Tapan K ^a   Jean, Jau Ho ^b  

^a WESTINGHOUSE ELECTRIC COMPANY   (United States)

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY MIXTURES; COMPOSITION; CRYSTAL GROWTH; DIELECTRIC MATERIALS; ELECTRONICS PACKAGING; FIRING (OF MATERIALS); MATHEMATICAL MODELS; MICROELECTRONICS; PERMITTIVITY; SINTERING; THERMAL EXPANSION;

COEFFICIENT OF THERMAL EXPANSION; COFIRING; CRISTOBALITE GROWTH; MICROELECTRONICS PACKAGING; SILICA DIELECTRIC;

SILICA;

EID: 0029760759     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.1996.0030     Document Type: Review

References (59)

1. T.K. Gupta, Int. J. Microcirct. Elect. Packaging, 17 1, First Qtr., pp 80-97 (1994).
2. R. R. Tummala, in Microelectronics Packaging Handbook, edited by R. R. Tummala and E. J. Rymaszewski (Van Nostrand Rein-hold. New York. 1989) Chap. 7.
3. J.I. Steinberg, S. J. Horowitz, and R.J. Bacher, in Advance in Ceramics. Vol 19. Multilayer Ceramic Devices, edited by J.B. Blum and W. R. Cannon (Am Ceram Soc. Inc., Westerville, OH, 1986). pp. 31-39.
4. W. D. Kingery. H K. Bowen. and D. R Uhlmann. in Introduction to Ceramics (John Wiley & Sons, New York. 1976). Chaps. 2-3 and 17-18
5. K. Kata, Y. Shimada, and H. Takamizawa, IEEE Trans. CHMT, 13 (2). 448-451 (1990).
6. T.K. Gupta, J.H. Bechtold, R.C Kuznicki, L.H. Kadoff, and B. R. Rossing, J. Mater Sci. 12, 2421-2426 (1977).
7. J-H. Jean and T. K. Gupta, J. Mater. Res. 9, 486-492 (1994).
8. J-H. Jean and T. K. Gupta, J. Mater. Res. 7, 3342-3347 (1992).
9. J-H. Jean and T. K. Gupta, J. Mater. Res. 7, 3103-3111 (1992) in Nucleation and Crystallization in Liquids and Glasses, edited by M.C. Weinberg, Ceram. Trans. 30, 347-354 (1993).
10. J-H. Jean and T. K. Gupta, J. Mater. Res. 7, 3103-3111 (1992) in Nucleation and Crystallization in Liquids and Glasses, edited by M.C. Weinberg, Ceram. Trans. 30, 347-354 (1993).
11. N. G. Ainslie, C. R. Morelock, and D. Turnbull, in Symposium on Nucleation and Crystallization in Glasses and Melts (Am. Cream. Soc., Westerville, OH, 1962), p. 97.
12. F.E. Wagstaff, S. D. Browns, and I. B. Cutler, Phys. Chem. Glasses 5, 76 (1964).
13. F.E. Wagstaff. J. Am. Ceram. Soc. 52. 650 (1969).
14. D. R. Uhlmann, in Advances in Nucleation and Crystallization in Glasses, edited by L.L. Hench and S. W. Freiman (Am. Cream. Soc., Westerville, OH, 1971), p. 91.
15. M. Avrami, J. Chem. Phys. 7, 1103 (1939); 8, 212 (1940); 9, 177 (1941).
16. M. Avrami, J. Chem. Phys. 7, 1103 (1939); 8, 212 (1940); 9, 177 (1941).
17. M. Avrami, J. Chem. Phys. 7, 1103 (1939); 8, 212 (1940); 9, 177 (1941).
18. W. Espe, in Materials of High Vacuum echonology (Programm Press, Oxford, 1968), Vol. 2, Chap. 10.
19. S.M. Cox and P.L. Kirby, Nature (London) 159, 162 (1947).
20. G.H. Frischat, in Ionic Diffusion in Oxide Glasses (Trans. Tech. Bay Village, OH, 1975), p. 138 and 147.
21. T. K. Gupta and J-H. Jean, J. Mater. Res. 9, 999-1005 (1994).
22. J-H Jean and T. K. Gupta, J. Mater. Res. 8, 356-363 (1993).
23. J-H. Jean and T. K. Gupta, J. Am. Ceram. Soc. 76 (8), 2010-2016 (1993); J. Mater. Rev 8. 1767-1769 (1993).
24. J-H. Jean and T. K. Gupta, J. Am. Ceram. Soc. 76 (8), 2010-2016 (1993); J. Mater. Rev 8. 1767-1769 (1993).
25. W Tie G. Fangtian, Z, Ao, Z, Yongzi, Z, Hiaoxing, and Q. Li, in Collected Papers: XIV Int. Cong. on Glass (Ind. Ceram. Soc., Calcutta, India, 1986), Vol. 1, p. 374.
26. Y. Imanaka, S. Aoki, N. Karnehara, and K. Niwa, J. Ceram. Soc. Jpn. Int. Ed. 95, 1066-1068 (1987); J. Fujitsu Sci. Tech. 25, 73-79 (1989).
27. Y. Imanaka, S. Aoki, N. Karnehara, and K. Niwa, J. Ceram. Soc. Jpn. Int. Ed. 95, 1066-1068 (1987); J. Fujitsu Sci. Tech. 25, 73-79 (1989).
28. J.F. MacDowell, Alumina Science and Techonology Handbook, (Am. Cream. Soc., Westerville, OH, 1990), p 365.
29. J-H. Jean and T. K. Gupta, J. Mater. Res. 7, 2514-2520 (1992).
30. 2 (Rutgers Univ. Press., New Brunswick, NJ, 1965), pp. 121-147.
31. R. W. Grimshaw, J. Hargreaves, and A. L. Roberts,Trans. Brit. Ceram. Soc. 55, 36-56 (1956).
32. J-H Jean and T. K. Gupta, J. Mater. Res. 10, 1312-1320 (1995): J. Am Ceram. Soc. 76 (3), 751-753 (1993).
33. J-H Jean and T. K. Gupta, J. Mater. Res. 10, 1312-1320 (1995): J. Am Ceram. Soc. 76 (3), 751-753 (1993).
34. J-H. Jean and T. K. Gupta, J. Mater. Res. 8, 2393-2399 (1993).
35. M.B. Volf, in Chemical Approach to Glasses (Elsevier, New York, 1984), p. 416.
36. J-H. Jean and T. K. Gupta, in Materials in Microelectronic and Optoelectronic Packaging, edited by H. C. Ling, K. Niwa, V. N. Shukla, Ceram. Trans. 33, 261-270 (1993); J. Mater. Res. 9. 771-780 (1994); J. Mater. Res. 9, 1990-1996 (1994).
37. J-H. Jean and T. K. Gupta, in Materials in Microelectronic and Optoelectronic Packaging, edited by H. C. Ling, K. Niwa, V. N. Shukla, Ceram. Trans. 33, 261-270 (1993); J. Mater. Res. 9. 771-780 (1994); J. Mater. Res. 9, 1990-1996 (1994).
38. J-H. Jean and T. K. Gupta, in Materials in Microelectronic and Optoelectronic Packaging, edited by H. C. Ling, K. Niwa, V. N. Shukla, Ceram. Trans. 33, 261-270 (1993); J. Mater. Res. 9. 771-780 (1994); J. Mater. Res. 9, 1990-1996 (1994).
39. J-H. Jean and T. K. Gupta, IEEE Trans. CPMT. Part B 17 (2), 228-133 (1994); Int. J. Microcircuits Elec. Packaging 17, (1), 2nd Qtr., 169-175 (1994) Int Elec. Pkg. Conf. (IEPS), 1993,Packaging 17 San Diego, CA, pp. 993-1002.
40. J-H. Jean and T. K. Gupta, IEEE Trans. CPMT. Part B 17 (2), 228-133 (1994); Int. J. Microcircuits Elec. Packaging 17, (1), 2nd Qtr., 169-175 (1994) Int Elec. Pkg. Conf. (IEPS), 1993,Packaging 17 San Diego, CA, pp. 993-1002.
41. J-H. Jean and T. K. Gupta, IEEE Trans. CPMT. Part B 17 (2), 228-133 (1994); Int. J. Microcircuits Elec. Packaging 17, (1), 2nd Qtr., 169-175 (1994) Int Elec. Pkg. Conf. (IEPS), 1993,Packaging 17 San Diego, CA, pp. 993-1002.
42. D.M. Mattox, S.R. Gurkovich, J.A. Olenick, and M Mason, Ceram. Eng. Sci. Proc. 9 (11-12), 1567-1578 (1988).
43. J. C. Maxwell, in Electricity and Magnetism (Clarendon, Oxford, 1892). Vol. 1, p. 452.
44. J. Turner, J. Res. Natl. Bur. Stand., 37, 239 (1946).
45. R.R. Tummala, J. Am. Ceram. Soc. 74 (5), 895-908 (1991).
46. A. H. Kumar and R. R. Tummala, Int. J. Hybrid Microelectron. 14 (4), 137-150 (1991)
47. H.T. Sawhill, R. H. Jensen, and K. R. Mikeska, Ceram. Trans. 15, 611-628 (1990).
48. Y. Shimada, K. Utsumi, and T. Ikeda, Int. J. Hybrid Microelectron. 7 (4), 29-37 (1984).
49. R. Kambe, Am. Ceram. Soc. Bull. 71 (6), 962-968 (1992)
50. S. Nishigaki, S. Yano, J. Fukuta, M. Fukaya, and T. Fuwa, ISHM 1985, 225-234 (1985).
51. H. C. Bhadwar, S. T. Sawhill, D. H. Scheiber, S. Kawasaki, and E. A. Kemp, Hyb. Circuit Tech. 31-38 (May 1989).
52. A. L. Dow and M. J. Green, Hybrid Tech., 28-32 (Oct. 1991).
53. F. Dilazzaro and D. Newmann, ISHM 1991, 409-413 (1991).
54. K. Kata, A. Sasaki, Y. Shimada, and K. Utsumi, ISHM 1990 Proc., 308-315 (1990).
55. G-Q. Lu, R. C. Sutterlin, and T. K. Gupta, J. Am. Ceram. Soc. 76 (8), 1907-1914 (1993).
56. R. C. Sutterlin, G-Q. Lu, and T. K. Gupta, in Materials in Microelectronic and Optoelectronic Packaging, edited by H. C. Ling. K. Niwa, and V. N. Shukla, Ceram. Trans. 33, 435-444 (1993)
57. G. M. Adema, M. J. Berry and I. Turlik, Elec. Packg. Prod., 72-76 (Feb. 1992).
58. P. Garrou, Elec. Packg. Prod. suppl. 44-47 (October 1992).
59. B. K. Gilbert and W. L. Walters, ICMCM Proceedings. 167-173 (1992).