Via production benefits from excimer-laser tools

Laser Focus World

Volumn 32, Issue 1, 1996, Pages 71-75

  Patel, R S ^a   Redmond, T F ^a   Tessler, C ^a   Tudryn, D ^a   Pulaski, D ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; ELECTRONICS PACKAGING; ETCHING; LASER ABLATION; MASKS; MICROELECTRONIC PROCESSING; MULTICHIP MODULES; OPTICAL DESIGN; OPTICAL SYSTEMS; POLYMERS; SEMICONDUCTOR DEVICE MANUFACTURE; THIN FILMS;

DIELECTRIC MASK; MICROELECTRONICS MANUFACTURING; OPTICAL EFFICIENCY; THIN FILM PACKAGING;

EXCIMER LASERS;

EID: 0029757013     PISSN: 10438092     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

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