|
|
|
Volumn 409, Issue , 1996, Pages 155-161
|
|
Simulation of thermal stresses, voids and fracture at the GaAs/ceramic interface
a
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
ACOUSTIC MICROSCOPES;
ALUMINA;
CERAMIC MATERIALS;
COMPUTER SIMULATION;
CRACK PROPAGATION;
DIES;
FINITE ELEMENT METHOD;
FRACTURE;
SEMICONDUCTING GALLIUM ARSENIDE;
TEMPERATURE;
THERMAL CYCLING;
THERMAL STRESS;
COMPUTER AIDED THERMOMECHANICAL MODELLING;
DIE CRACKING;
DIE STRESSES;
POWER CYCLING;
TEMPERATURE CYCLING;
THERMAL MANAGEMENT;
VOIDS;
INTERFACES (MATERIALS);
|
|
EID: 0029756987
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
|
Times cited : (3)
|
|
References (4)
|
