The microstructure of Cu-Al

Acta Materialia

Volumn 44, Issue 1, 1996, Pages 335-342

  Schonfeld B ^a   Roelofs, H ^a   Malik, A ^a   Kostorz, G ^a   Plessing, J ^b   Neuhauser H ^b  

^a ETH ZURICH   (Switzerland)

^b TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; ELECTRON ENERGY LEVELS; METALLOGRAPHIC MICROSTRUCTURE; SINGLE CRYSTALS; STOICHIOMETRY; THERMAL EFFECTS; THERMODYNAMIC STABILITY; X RAY ANALYSIS;

GEORGOPOULOS-COHEN METHOD;

COPPER ALLOYS;

EID: 0029755633     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/1359-6454(95)00164-9     Document Type: Article

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