Role of MCMs in wireless communications

Proceedings of the IEEE Multi-Chip Module Conference

Volumn , Issue , 1996, Pages 2-5

  Baker, William D ^a  

^a Wireless Access   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH DENSITY PACKAGING; MULTICHIP MODULES TECHNOLOGY;

COMPETITION; COST EFFECTIVENESS; ELECTRONICS PACKAGING; MARKETING; RADIO COMMUNICATION; RELIABILITY;

MULTICHIP MODULES;

EID: 0029755302     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)