Indirect tip fabrication for Scanning Probe Microscopy

Microelectronic Engineering

Volumn 30, Issue 1-4, 1996, Pages 579-582

  Boisen, A ^a   Rasmussen, J P ^b   Hansen, O ^b   Bouwstra, S ^b  

^a DME Danish Micro Engineering A/S   (Denmark)

^b TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; ATOMIC FORCE MICROSCOPY; CONDUCTIVE MATERIALS; ELECTROPLATING; MICROSCOPIC EXAMINATION; NICKEL; REACTIVE ION ETCHING; SCANNING TUNNELING MICROSCOPY; SEMICONDUCTING SILICON; SUBSTRATES;

MOULD TECHNIQUE; SCANNING PROBE MICROSCOPY; TIPS; WET ANISOTROPIC ETCHING;

MICROELECTRONIC PROCESSING;

EID: 0029754245     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/0167-9317(95)00314-2     Document Type: Article

References (6)

1. J. Brugger et al, Sensors and Actuators A, 34 (1992) 193-200
2. I.W. Rangelow, Microelectronic Engineering, 23 (1994) 369-372
3. J. Itoh et al, J. Vac. Sci. Technol. B 13(2) (1995) 331-334
4. A. Boisen et al, Proceedings of Micromechanichs Europe (1995) 76-79
5. T.R. Albrecht and C.F. Quate, J. Vac. Sci. Technol. A, 8 (4) (1990) 3386-3396
6. S. Akamine and C.F. Quate, J. Vac. Sci. Technol. B, 10 (5) (1992) 2307-2310