The microstructure and creep deformation of hot-pressed Si3N4 with different amounts of sintering additives

Journal of Materials Research

Volumn 11, Issue 1, 1996, Pages 120-126

  Yoon, Sang Young ^a   Akatsu, Takashi ^a   Yasuda, Eiichi ^a  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; ADDITIVES; CREEP; CREEP TESTING; DIFFUSION IN SOLIDS; GRAIN BOUNDARIES; HOT PRESSING; MICROSTRUCTURE; RECRYSTALLIZATION (METALLURGY); SINTERING; STRESSES;

APPLIED STRESS; CREEP DEFORMATION; GRAIN BOUNDARY GLASS PHASE; SOLUTION REPRECIPITATION;

SILICON NITRIDE;

EID: 0029752322     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.1996.0015     Document Type: Article

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