Packaging and qualification of MEMS-based space systems

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 1996, Pages 503-508

  Muller, L ^a   Hecht, M H ^a   Miller, L M ^a   Rockstad, H K ^a   Lyke, J C ^a  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATORS; AEROSPACE APPLICATIONS; COSTS; INTEGRATED CIRCUITS; MICROELECTRONICS; MULTICHIP MODULES; PACKAGING; PERFORMANCE; RELIABILITY; SENSORS; SPACECRAFT; STANDARDS;

CATASTROPHIC FAILURE; MICROSPACECRAFT; SPACE QUALIFICATION; SPACE SYSTEMS;

MICROELECTROMECHANICAL DEVICES;

EID: 0029752134     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)