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Volumn 36, Issue 1, 1996, Pages 106-116
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Selection of adhesive system for radio-frequency heating of structural sheet molding compound components
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Author keywords
[No Author keywords available]
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Indexed keywords
BONDING;
COMPUTER SIMULATION;
CURING;
HEATING;
MATERIALS TESTING;
QUALITY ASSURANCE;
REACTION KINETICS;
SHEET MOLDING COMPOUNDS;
ADHESIVE EXOTHERMAL REACTION KINETICS;
ADHESIVE SYSTEM;
PROCESS MECHANISM;
PROCESSING CYCLE;
RADIO FREQUENCY BASED CURING;
RADIO FREQUENCY HEATING;
STRUCTURAL SHEET MOLDING COMPOUND COMPONENTS;
PLASTIC ADHESIVES;
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EID: 0029734009
PISSN: 00323888
EISSN: None
Source Type: Journal
DOI: 10.1002/pen.10391 Document Type: Article |
Times cited : (7)
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References (11)
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