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Volumn 36, Issue 1, 1996, Pages 106-116

Selection of adhesive system for radio-frequency heating of structural sheet molding compound components

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COMPUTER SIMULATION; CURING; HEATING; MATERIALS TESTING; QUALITY ASSURANCE; REACTION KINETICS; SHEET MOLDING COMPOUNDS;

EID: 0029734009     PISSN: 00323888     EISSN: None     Source Type: Journal    
DOI: 10.1002/pen.10391     Document Type: Article
Times cited : (7)

References (11)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.