New multichip-on-silicon packaging scheme with integrated passive components

Proceedings of the IEEE Multi-Chip Module Conference

Volumn , Issue , 1996, Pages 73-77

  Guerin, L ^a   Sachot, R ^a   Dutoit, M ^a  

^a EPFL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATORS; CAPACITORS; CERAMIC MATERIALS; ELECTRIC INDUCTORS; ELECTRONICS PACKAGING; INTEGRATED CIRCUITS; METALLIZING; MICROELECTRONIC PROCESSING; MIM DEVICES; SENSORS; SILICON WAFERS; THERMAL STRESS;

MICROELECTRONIC CIRCUITS; MULTICHIP ON SILICON PACKAGING;

MULTICHIP MODULES;

EID: 0029733173     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)