Micro mechanical single crystal silicon fracture studies - torsion and bending

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 1996, Pages 105-109

  Saif, M T A ^a   MacDonald, N C ^a  

^a Department of Obstetrics Gynecology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); FAILURE (MECHANICAL); FAILURE ANALYSIS; FRACTURE TOUGHNESS; MATERIALS TESTING; SEMICONDUCTING SILICON; SHEAR STRESS; SINGLE CRYSTALS; TORSIONAL STRESS;

LOADING DEVICE; SINGLE CRYSTAL SILICON; SUBMICRON SCALE;

MICROELECTROMECHANICAL DEVICES;

EID: 0029732714     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)