Characterizing microroughness and haze on silicon wafers

MICRO

Volumn 14, Issue 1, 1996, Pages 47-X

  Bullis, W Murray ^a,b,c,d,e,f  

^a R and D at Siltec Silicon ^*

^b Electron Devices Division

^c MIAMI UNIVERSITY   (United States)

^d Architecture Machine Group

^e ELECTROCHEMICAL SOCIETY

^f IEEE

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; FOURIER TRANSFORMS; GRAPHIC METHODS; INSPECTION; INSPECTION EQUIPMENT; OPTICAL MICROSCOPY; ROUGHNESS MEASUREMENT; SCANNING; SPECIFICATIONS; SURFACE MEASUREMENT; SURFACE ROUGHNESS; TEXTURES;

HAZE; MEASURING INSTRUMENTS; MICROROUGHNESS; POWER SPECTRAL DENSITY; SCANNING SURFACE INSPECTION SYSTEMS; SURFACE TEXTURE; WAVELENGTH;

SILICON WAFERS;

EID: 0029732164     PISSN: 10810595     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)

1. Surface Texture (Surface Roughness, Waviness, and Lay), ANSI/ASME B46.1, New York, American Society for Mechanical Engineers (ASME), 1985; currently being revised and expanded.
2. Stover JC, Optical Scattering: Measurement and Analysis, 2nd ed, Bellingham, WA, SPIE Optical Engineering Press, chaps 1-4, 1995.
3. Strausser YE, Doris B, Diebold AC, and Huff HR, "Measurement of Silicon Surface Microroughness by AFM," Abstract No. 284 in Extended Abstracts of the Spring 1994 Meeting of the Electrochemical Society, San Francisco, May 1994.
4. "Terminology of Silicon Technology," ASTM F 1241-95, West Conshohocken, PA, American Society for Testing and Materials, 1995.
5. Stover JC, Optical Scattering: Measurement and Analysis, 2nd ed, Bellingham, WA, SPIE Optical Engineering Press, sect 4.6, 1995.