Thermoelectric properties of Bi-Sb composite prepared by mechanical alloying method

International Conference on Thermoelectrics, ICT, Proceedings

Volumn , Issue , 1996, Pages 18-21

  Miyajima, Masafumi ^a   Takagi, Kenta ^a   Okamura, Hiroshi ^a   Lee, Gil Geun ^a   Noda, Yasutoshi ^a   Watanabe, Ryuzo ^a  

^a DAIKIN INDUSTRIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BISMUTH ALLOYS; COMPOSITE MATERIALS; CRYSTAL MICROSTRUCTURE; ELECTRIC CONDUCTIVITY MEASUREMENT; GRAIN SIZE AND SHAPE; HALL EFFECT; HOT PRESSING; MECHANICAL ALLOYING; SINGLE CRYSTALS; THERMAL CONDUCTIVITY; THERMAL VARIABLES MEASUREMENT; THERMOELECTRICITY;

FINE-DISPERSED CERAMIC PARTICLES; THERMOELECTRIC PROPERTIES; VAN DER PAUW METHOD;

SEMICONDUCTING BISMUTH COMPOUNDS;

EID: 0029728737     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)