Influence of die attachment on MOS transistor matching

IEEE International Conference on Microelectronic Test Structures

Volumn , Issue , 1996, Pages 27-31

  Bastos, J ^a   Steyaert, M ^a   Graindourze, B ^a   Sansen, W ^a  

^a UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; BONDING; CMOS INTEGRATED CIRCUITS; DYES; ELECTRONICS PACKAGING; EUTECTICS; GATES (TRANSISTOR); MOSFET DEVICES; PARAMETER ESTIMATION; POLYIMIDES; RESIDUAL STRESSES; SEMICONDUCTOR MATERIALS;

DIE ATTACHMENT; EUTECTIC DIE BONDING; MOS TRANSISTOR MATCHING; PARAMETER EXTRACTION; TEST CHIP;

INTEGRATED CIRCUITS;

EID: 0029725015     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)