New chip interconnection technic for ultra high-speed and millimeter-wave applications

IEEE MTT-S International Microwave Symposium Digest

Volumn 3, Issue , 1996, Pages 1611-1614

  Hanke, Gerhard ^a   Nohr, Wolf Dieter ^a  

^a DARMSTADT UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC LINES; ELECTRIC NETWORK PARAMETERS; MILLIMETER WAVE DEVICES; SEMICONDUCTOR DEVICE MANUFACTURE;

REVERSE BEAM LEAD INTERCONNECTIONS;

ELECTRONICS PACKAGING;

EID: 0029723674     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)