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Volumn , Issue , 1996, Pages 164-171
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Electromigration failure distribution of contacts and vias as a function of stress conditions in submicron IC metallizations
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Author keywords
[No Author keywords available]
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Indexed keywords
ELECTRIC CONTACTS;
ELECTROMIGRATION;
FAILURE ANALYSIS;
MATHEMATICAL MODELS;
METALLIZING;
STRESSES;
ELECTROMIGRATION FAILURE DISTRIBUTION;
VIAS;
VOIDING;
INTEGRATED CIRCUIT TESTING;
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EID: 0029721910
PISSN: 00999512
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/relphy.1996.492077 Document Type: Conference Paper |
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Times cited : (9)
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References (0)
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