Failure mechanism of solidification cracks in semiconductor laser packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 946-950

  Chen, J C ^a   Chen, W T ^a   Chang, S T ^a   Horng, J S ^a   Lin, H H ^a   Sun, M J ^a   Wang, W H ^a   Cheng, W H ^a  

^a Electronics and Opto Electronics Research Lab   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CRACKS; GOLD; LASER BEAM WELDING; MICROSCOPIC EXAMINATION; NEODYMIUM LASERS; RELIABILITY; SEMICONDUCTOR LASERS; SOLIDIFICATION; STAINLESS STEEL; THICKNESS CONTROL; WELDS;

POST WELD SHIFT; SEMICONDUCTOR LASER PACKAGING; SPOT WELDING TECHNIQUE;

ELECTRONICS PACKAGING;

EID: 0029721226     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (11)