Thermal characterization of a 3-dimensional memory module

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 1996, Pages 14-18

  Kim, Tae Hyun ^a   Baek, Joong Hyun ^a   Seol, S H ^a   Kim, J J ^a   Kim, Y S ^a   Sun, Y B ^a   Oh, S Y ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; COMPUTER SIMULATION; ELECTRIC WIRING; HEAT LOSSES; PLASTICS APPLICATIONS; SEMICONDUCTOR STORAGE; STANDARDS; TEMPERATURE DISTRIBUTION; THERMAL VARIABLES MEASUREMENT; THERMODYNAMIC PROPERTIES; THREE DIMENSIONAL;

PACKAGING DENSITY; PLASTIC PACKAGE; STACKED PACKAGE; THERMAL PERFORMANCE; THERMAL RESISTANCE; THERMAL TEST CHIPS; THREE DIMENSIONAL MEMORY MODULE;

ELECTRONICS PACKAGING;

EID: 0029718344     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)