Stress management and reliability assessment in electronic packaging

National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)

Volumn 3, Issue , 1996, Pages 1711-1726

  Vaynman, S ^a   Mavoori, H ^a   Chin, J ^a   Fine, M E ^a   Moran, B ^a   Keer, L M ^a  

^a NORTHWESTERN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; DEFORMATION; ELECTRIC WIRING; FAILURE (MECHANICAL); FATIGUE OF MATERIALS; RELIABILITY; STRESS ANALYSIS; STRESS RELAXATION; THERMAL EXPANSION; THERMAL STRESS; THERMOMECHANICAL TREATMENT;

COEFFICIENTS OF THERMAL EXPANSION; INTERCONNECTS; METALLIZATIONS; RELIABILITY ASSESSMENT; STRESS MANAGEMENT;

ELECTRONICS PACKAGING;

EID: 0029718132     PISSN: 04700155     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (26)