Manufacturable and reliable fluorine-doped low-k interlayer dielectric process for high performance logic LSI

Digest of Technical Papers - Symposium on VLSI Technology

Volumn , Issue , 1996, Pages 84-85

  Igarashi, H ^a   Oyamatsu, H ^a   Kodera, M ^a   Kaji, N ^a   Matsuno, T ^a   Shibata, H ^a   Kinugawa, M ^a   Kakumu, M ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL POLISHING; CMOS INTEGRATED CIRCUITS; CURRENT VOLTAGE CHARACTERISTICS; DIELECTRIC FILMS; FLUORINE; HOT CARRIERS; LOGIC CIRCUITS; LSI CIRCUITS; MOSFET DEVICES; PERMITTIVITY; SILICA; SPECTROSCOPY;

CHEMICAL MECHANICAL POLISHING; CMOS INTEGRATION; HOT CARRIER DEGRADATION; INTERLAYER DIELECTRIC PROCESS; LOGIC LSI;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0029713417     PISSN: 07431562     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)