Bonding of alumina to steel using copper interlayer

Journal of Materials Processing Technology

Volumn 56, Issue 1-4, 1996, Pages 190-199

  Wlosinski W ^a   Olesinska W ^a   Pietrzak, K ^a  

^a ukasiewicz Research Network Institute of Microelectronics and Photonics   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); BONDING; COPPER; COPPER OXIDES; INTERFACES (MATERIALS); MATERIALS TESTING; METALLOGRAPHIC MICROSTRUCTURE; MULTILAYERS; REDUCTION; STEEL;

COPPER INTERLAYER; HOMOGENEOUS MICROSTRUCTURE;

ALUMINA;

EID: 0029713319     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/0924-0136(96)85102-8     Document Type: Article

References (7)

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3. Electronic Production, Vol. 3, No. 5, 1974, p.32
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7. F.A. Calvo, A. Urena, J.M. Gomez de Salazar, F. Molleda: Tensile strength of Armco iron-ETP copper diffusion bonds J.of Matl. Sci.Letters 8 (1989) 137-140.