Convection modelling of flip chip and wirebond surface mounted modules

Thermal Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1996, Pages 174-176

  Yuan, T D ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; HEAT CONVECTION; HEAT RESISTANCE; HEAT TRANSFER COEFFICIENTS; MATHEMATICAL MODELS; SURFACE MOUNT TECHNOLOGY; TEMPERATURE DISTRIBUTION;

THERMAL MANAGEMENT; WIREBOND INTERCONNECTIONS;

FLIP CHIP DEVICES;

EID: 0029712446     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)