System performance of a lightweight beryllium composite heat sink for advanced electronic packaging

National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)

Volumn , Issue , 1996, Pages 325-334

  Parsonage, Thomas B ^a  

^a Brush Wellman Inc North America   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BERYLLIUM OXIDE; COEFFICIENT OF THERMAL EXPANSION; LIGHTWEIGHT MATERIALS; STANDARD ELECTRONIC MODULES;

AEROSPACE APPLICATIONS; BERYLLIUM ALLOYS; ELECTRONICS PACKAGING; METALLIC MATRIX COMPOSITES; MULTICHIP MODULES; THERMAL CONDUCTIVITY; VOLUME FRACTION;

HEAT SINKS;

EID: 0029710624     PISSN: 04700155     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)