Advanced monolithic packaging concepts for high performance circuits and antennas

IEEE MTT-S International Microwave Symposium Digest

Volumn 3, Issue , 1996, Pages 1615-1618

  Drayton, Rhonda F ^a   Henderson, Rashaunda M ^a   Katehi, Linda P B ^a  

^a UNIVERSITY OF ILLINOIS AT CHICAGO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CROSSTALK; INTEGRATED CIRCUIT LAYOUT; INTERFERENCE SUPPRESSION; MICROMACHINING; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

CONFORMAL MICROMACHINED PACKAGING; MONOLITHIC PACKAGING; PLANAR CIRCUITS;

ELECTRONICS PACKAGING;

EID: 0029709530     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)