Development of prediction technique for cooling performance of finned heat sink in uniform flow

Thermal Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1996, Pages 108-114

  Sata, Yutaka ^a   Iwasaki, Hideo ^a   Ishizuka, Masaru ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COOLING; ELECTRONICS PACKAGING; FLOW MEASUREMENT; FRICTION; HEAT TRANSFER; PRESSURE EFFECTS; REYNOLDS NUMBER;

PLATE FIN ARRAY; PRESSURE DISTRIBUTION; UNIFORM FLOW VELOCITY;

FINS (HEAT EXCHANGE);

EID: 0029709412     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)