Prevention of aluminum pad corrosion by UV/ozone cleaning

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 107-112

  Ahn, Seung Ho ^a   Cho, Tae Je ^a   Kim, Yoon Soo ^a   Oh, Se Yong ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC IMAGING; ADHESION; ALUMINUM CORROSION; BOND STRENGTH (MATERIALS); CLEANING; CORROSION PREVENTION; CORROSION RESISTANCE; DELAMINATION; INTERFACES (MATERIALS); OPTICAL MICROSCOPY; PACKAGING MATERIALS; PLASTICS APPLICATIONS;

ADHESION STRENGTH; CHIP MOLDING COMPOUND INTERFACE; OZONE CLEANING; SCANNING ACOUSTIC TOMOGRAPHY; ULTRAVIOLET CLEANING;

ELECTRONICS PACKAGING;

EID: 0029709206     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (3)