Laser soldering and inspection of fine pitch electronic components

Journal of Materials Processing Technology

Volumn 56, Issue 1-4, 1996, Pages 531-541

  Flanagan, A ^a   Conneely, A ^a   Glynn, T J ^a   Lowe, G ^a  

^a NATIONAL UNIVERSITY OF IRELAND   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COMPUTER VISION; FINITE ELEMENT METHOD; INSPECTION; MATHEMATICAL MODELS; NEODYMIUM LASERS; ROBOTICS; SOLDERED JOINTS; SOLDERING; THERMAL EFFECTS; THERMOANALYSIS; THERMOCOUPLES;

FINE PITCH ELECTRONIC COMPONENTS; LEAD CERAMIC CHIP; MINIATURISATION; QUAD FLATPACK DEVICE;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0029708717     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/0924-0136(95)01867-0     Document Type: Article

References (10)

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3. F. Burns, C. Zyetz, Laser microsoldering, Electronic Packaging and Production, May, 1981.
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5. D.G. Whitehead, A.V. Polijanczuk, P.M. Beckett, Reflow soldering by laser, ASME Heat transfer conference, Dallas, 1990.
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7. RS/Discover, Version 2.0, BBN Software Products Corporation, Cambridge, Mass.
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10. A. Conneely, Development of a Laser Soldering Workcell for Surface Mount Devices, M.Sc. Thesis, University College Galway, 1993.