Multiple-attachment GaAs-on-Si hybrid optoelectronic/VLSI chips

LEOS Summer Topical Meeting

Volumn , Issue , 1996, Pages

  Goossen, K W ^a   Tseng, B ^a   Hui, S P ^a   Walker, J A ^a   Leibenguth, R ^a   Chirovsky, L M F ^a   Krishnamoorthy, A ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CMOS INTEGRATED CIRCUITS; HYBRID INTEGRATED CIRCUITS; LSI CIRCUITS; MODULATORS; OPTICAL INTERCONNECTS; OPTOELECTRONIC DEVICES; SEMICONDUCTING GALLIUM ARSENIDE; SEMICONDUCTING SILICON; SEMICONDUCTOR QUANTUM WELLS; SWITCHING CIRCUITS; VLSI CIRCUITS;

FLIP FLOP BONDING; HYBRIDIZATION PROCESS; JET ETCHER; MULTI ATTACHMENT TECHNOLOGY; SURFACE EMITTING LASERS; THERMOCOMPRESSION BONDING;

INTEGRATED OPTOELECTRONICS;

EID: 0029708193     PISSN: 10994742     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)