Packaging of two-dimensional smart pixel arrays

LEOS Summer Topical Meeting

Volumn , Issue , 1996, Pages

  Kabal, D N ^a   Boisset, G C ^a   Rolston, D R ^a   Plant, D V ^a  

^a MCGILL UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAYS; BANDWIDTH; CMOS INTEGRATED CIRCUITS; ELECTRONICS PACKAGING; FABRICATION; MANAGEMENT; OPTICAL INTERCONNECTS; OPTICAL SYSTEMS; PRINTED CIRCUIT BOARDS; SURFACE MOUNT TECHNOLOGY;

DAUGHTER BOARD; DUAL IN LINE PACKAGES; ELECTRICAL CONNECTIVITY; OPTICAL ALIGNABILITY; PIN GRID ARRAYS; SMART PIXEL ARRAYS; THERMAL MANAGEMENT; THROUGH HOLE CARRIERS;

OPTOELECTRONIC DEVICES;

EID: 0029707766     PISSN: 10994742     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)