Novel bonding technique to bond CTE mismatched devices

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 1151-1158

  Chardran, B ^a   Schmidt, W F ^a   Gordon, M H ^a  

^a UNIVERSITY OF ARKANSAS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COOLING; CREEP; GOLD ALLOYS; NUMERICAL ANALYSIS; OPTICAL DEVICES; SEMICONDUCTING GALLIUM ARSENIDE; SOLDERING ALLOYS; THERMAL EXPANSION; THERMAL STRESS;

COEFFICIENTS OF THERMAL EXPANSION; MISMATCHED DEVICES; SOLDER LAYER CREEP;

ELECTRONICS PACKAGING;

EID: 0029705662     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (21)