Quantitative disassembly evaluation

IEEE International Symposium on Electronics & the Environment

Volumn , Issue , 1996, Pages 19-24

  Suga, T ^a   Saneshige, K ^a   Fujimoto, J ^a  

^a UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; CALCULATIONS; DEFORMATION; ENTROPY; EVALUATION; JOINING; PERSONAL COMPUTERS; TIME MEASUREMENT; TORQUE;

CHEMICAL DISASSEMBLY; CHEMICAL JOINING TECHNIQUES; DESIGN FOR DISASSEMBLY; DISASSEMBLY ENERGY; DISASSEMBLY ENTROPY; MECHANICAL DISASSEMBLY; NET DISASSEMBLY TIME;

PRODUCT DESIGN;

EID: 0029703444     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)