Rapid thermal modeling for smart-power and integrated multichip power circuit design

IEEE International Symposium on Power Semiconductor Devices & ICs (ISPSD)

Volumn , Issue , 1996, Pages 173-176

  Dupuy, P ^a   Dorkel, J M ^a   Tounsi, P ^a   Borucki, L ^a  

^a CNRS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; HEAT TRANSFER; INTEGRATED CIRCUIT LAYOUT; MATHEMATICAL MODELS; MULTICHIP MODULES;

INTEGRATED MULTICHIP POWER CIRCUIT DESIGN; RAPID THERMAL MODELING;

POWER ELECTRONICS;

EID: 0029701475     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)