Reliability and electrical properties of new low dielectric constant interlevel dielectrics for high performance ULSI interconnect

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 1996, Pages 156-163

  Zhao, B ^a   Wang, S Q ^a   Fiebig, M ^a   Anderson, S ^a   Vasudev, P K ^a   Seidel, T E ^a  

^a SEMATECH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; ELECTRIC PROPERTIES; ELECTRIC WIRING; PERMITTIVITY; PLASMA APPLICATIONS; POLYETHERS; POLYIMIDES; RELIABILITY; THERMAL STRESS; ULSI CIRCUITS;

INTERCONNECTS; LOW DIELECTRIC CONSTANT INTERLEVEL DIELECTRICS;

DIELECTRIC MATERIALS;

EID: 0029700868     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/relphy.1996.492076     Document Type: Conference Paper

References (20)