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Volumn 32, Issue 1, 1996, Pages 136-141

Electron shading effect during plasma process

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CHARGE; FABRICATION; PLASMA ETCHING; THERMAL EFFECTS;

EID: 0029699985     PISSN: 00162523     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (2)

References (10)
  • 1
    • 3342896463 scopus 로고
    • The Influence of Incident Angle Distributions of Plasma Particles on the Etched Profiles of Silicon Films
    • Morimoto, T., Takahashi, C., and Matsuo, S.: The Influence of Incident Angle Distributions of Plasma Particles on the Etched Profiles of Silicon Films. Proc. Symp. on DryProcess, pp.57-62 (1991).
    • (1991) Proc. Symp. on DryProcess , pp. 57-62
    • Morimoto, T.1    Takahashi, C.2    Matsuo, S.3
  • 2
    • 0028404943 scopus 로고
    • Effect Plasma Transport on Etched Profiles with Surface Topography in Diverging Field Electron Cyclotron Resonance Plasma
    • Fujiwara, N., Maruyama, T., Yoneda, M., Tsukamoto, K., and Banjo, T.: Effect Plasma Transport on Etched Profiles with Surface Topography in Diverging Field Electron Cyclotron Resonance Plasma. Jpn. J. Appl. Phys, 33, 4B, pp.2164-2169 (1994).
    • (1994) Jpn. J. Appl. Phys , vol.33 , Issue.4 B , pp. 2164-2169
    • Maruyama, T.1    Yoneda, M.2    Tsukamoto, K.3    Banjo, T.4
  • 4
    • 0028529702 scopus 로고
    • Charge Damage Caused by Electron Shading Effect
    • Hashimoto, K.: Charge Damage Caused by Electron Shading Effect. Jpn. J. Appl. Phys., 33, 10, pp.6013-6018 (1994).
    • (1994) Jpn. J. Appl. Phys. , vol.33 , Issue.10 , pp. 6013-6018
    • Hashimoto, K.1
  • 5
    • 0000302625 scopus 로고
    • The Influence of Substrate Topography on Ion Bombardment in Plasma Etching
    • Ingram, S. G.: The Influence of Substrate Topography on Ion Bombardment in Plasma Etching. J. Appl. Phys., 68, 2, pp.500-504 (1990).
    • (1990) J. Appl. Phys. , vol.68 , Issue.2 , pp. 500-504
    • Ingram, S.G.1
  • 6
    • 0346651219 scopus 로고
    • Charging of Pattern Features during Plasma Etching
    • Arnold, J. C. and Sawin, H. H.: Charging of Pattern Features during Plasma Etching. J. Appl. Phys., 70, 10, pp.5314-5317 (1991).
    • (1991) J. Appl. Phys. , vol.70 , Issue.10 , pp. 5314-5317
    • Arnold, J.C.1    Sawin, H.H.2
  • 7
    • 3643082365 scopus 로고
    • Electron and Ion Current from Ar Plasma into Si Substrate Covered with Line-Patterned SiO2 Film
    • Arimoto, H., Kamata, T., and Horiuchi, K.: Electron and Ion Current from Ar Plasma into Si Substrate Covered with Line-Patterned SiO2 Film. Digest of the 8th Int. MicroProcess Conference, pp.148-149 (1995).
    • (1995) Digest of the 8th Int. MicroProcess Conference , pp. 148-149
    • Arimoto, H.1    Kamata, T.2    Horiuchi, K.3
  • 10
    • 0027867586 scopus 로고
    • New Phenomena of Charge Damage in Plasma Etching:Heavy Damage only through Dense-Line Antenna
    • Hashimoto, K.: New Phenomena of Charge Damage in Plasma Etching:Heavy Damage Only through Dense-Line Antenna. Jpn. J. Appl. Phys., 32, 12B, pp.6109-6113 (1993).
    • (1993) Jpn. J. Appl. Phys. , vol.32 , Issue.12 B , pp. 6109-6113
    • Hashimoto, K.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.