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Volumn , Issue , 1996, Pages 884-887
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High frequency modeling for 10Gbps DFB laser diode module packaging
a a a a a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
BANDWIDTH;
BONDING;
COMPUTER AIDED ANALYSIS;
COMPUTER SIMULATION;
DISTRIBUTED FEEDBACK LASERS;
ELECTRIC LINES;
ELECTRIC VARIABLES MEASUREMENT;
ELECTRIC WIRING;
FREQUENCY RESPONSE;
MATHEMATICAL MODELS;
RESISTORS;
SEMICONDUCTOR LASERS;
MATCHING RESISTOR;
MODULATION BANDWIDTH;
RETURN LOSS;
SMALL SIGNAL CIRCUIT MODEL;
WIRE BONDING INDUCTANCE;
WIRE BONDING INTERCONNECT;
ELECTRONICS PACKAGING;
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EID: 0029699472
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Article |
Times cited : (11)
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References (4)
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