Reliability and characterization of MLC decoupling capacitors with C4 interconnections

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 365-374

  Scheider, Donald ^a   Hopkins, Donald ^a   Zucco, Paul ^a   Moszczynski, Edward ^a   Griffin, Michael ^a   Takacs, Mark ^a   Galvagni, John ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BARIUM TITANATE; CAPACITANCE; CHARACTERIZATION; DIELECTRIC MATERIALS; ELECTRODES; HEAT RESISTANCE; INDUCTANCE MEASUREMENT; LEAKAGE CURRENTS; MULTICHIP MODULES; PLATINUM; RELIABILITY; SHOCK TESTING;

CONTROLLED COLLAPSED CHIP CONNECTIONS; ELECTRICAL CHARACTERIZATION; LIQUID TO LIQUID THERMAL SHOCK; MOISTURE RESISTANCE; SELF RESONANCE TECHNIQUE; STRESS TESTING;

CERAMIC CAPACITORS;

EID: 0029699453     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (5)