Multi-chip hybrid integration on PLC platform using passive alignment technique

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 20-25

  Nakasuga, Y ^a   Hashimoto, T ^a   Yamada, Y ^a   Terui, H ^a   Yanagisawa, M ^a   Moriwaki, K ^a   Akahori, Y ^a   Tohmori, Y ^a   Kato, K ^a   Sekine, S ^a   Horiguchi, M ^a  

^a NTT CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); INTEGRATED CIRCUIT MANUFACTURE; MULTICHIP MODULES; OPTICAL WAVEGUIDES; PHOTODETECTORS; SEMICONDUCTOR LASERS; SOLDERING; TRANSCEIVERS; TRANSMITTERS;

MULTICHIP HYBRID INTEGRATION; OPTICAL MODULES; PASSIVE ALIGNMENT TECHNIQUE; PLANAR LIGHTWAVE CIRCUIT; SOLDER REFLOWING STEP;

INTEGRATED OPTOELECTRONICS;

EID: 0029699445     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (16)