Characterization of the fatigue properties of bonding wires

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 836-841

  Deyhim, Alex ^a   Yost, Boris ^a   Lii, Mirng Ji ^a   Li, Che Yu ^a  

^a Department of Obstetrics Gynecology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); BONDING; ELECTRIC WIRE; ELECTRIC WIRING; FATIGUE OF MATERIALS; INTEGRATED CIRCUITS; MATERIALS TESTING; POLYTETRAFLUOROETHYLENES; RELIABILITY; STRAIN;

BONDING WIRES; INTERCONNECTIONS; MANDRELS; WIRE BONDING;

ELECTRONICS PACKAGING;

EID: 0029698879     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (4)