Effective transient process modelling of the reflow soldering of printed circuit assemblies

Thermal Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1996, Pages 195-202

  Sarvar, Farhad ^a   Conway, Paul P ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT TRANSFER; MATHEMATICAL MODELS; PRINTED CIRCUIT DESIGN; SOLDERING; SPECIFIC HEAT OF SOLIDS; THERMAL CONDUCTIVITY OF SOLIDS;

PRINTED CIRCUIT ASSEMBLIES; REFLOW SOLDERING;

PRINTED CIRCUIT MANUFACTURE;

EID: 0029698698     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)