Evaluation of mode-II fracture energy of adhesive joints with different bond thickness

Journal of Adhesion

Volumn 56, Issue 1-4, 1996, Pages 171-186

  Daghyani, Hamld Reza ^a   Lin, Ye ^a   Mai, Yiu Wing ^a  

^a UNIVERSITY OF SYDNEY   (Australia)

Author keywords

Adhesive joints; Bond thickness; Mode II fracture toughness; Rubber modified epoxy; Strain energy release rate

Indexed keywords

BOND THICKNESS; COMPACT PURE SHEAR; CRACK CLOSURE TECHNIQUE; RUBBER MODIFIED EPOXY; STRAIN ENERGY RELEASE RATE;

CALCULATIONS; EPOXY RESINS; FINITE ELEMENT METHOD; FRACTURE TOUGHNESS; INTERFACES (MATERIALS); MATHEMATICAL MODELS; SCANNING ELECTRON MICROSCOPY; STRAIN RATE; SURFACES;

ADHESIVE JOINTS;

EID: 0029697239     PISSN: 00218464     EISSN: None     Source Type: Journal    
DOI: 10.1080/00218469608010506     Document Type: Article

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