Evaluation of a high-temperature adhesive for aerospace structural bonding

International SAMPE Symposium and Exhibition (Proceedings)

Volumn 41, Issue 2, 1996, Pages 1035-1046

  Falcone, A ^a   Pate, K D ^a   Cao, T Q ^a   Hsu, G F ^a   Rogalski, M E ^a  

^a BOEING COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AEROSPACE APPLICATIONS; AGING OF MATERIALS; BONDING; DURABILITY; HIGH TEMPERATURE APPLICATIONS; HONEYCOMB STRUCTURES; MECHANICAL TESTING; OLIGOMERS; PLASTIC FILMS; POLYIMIDES; TITANIUM;

ADHESIVE FILMS; CLIMBING DRUM PEEL TESTING; DURABILITY TESTING; FLATWISE TENSION TESTING; PHENYLETHYNYL TERMINATED OLIGOMERS; SINGLE LAP SHEAR TESTING; THERMAL AGING; WEDGE CRACK EXTENSION TESTING;

ADHESIVES;

EID: 0029697140     PISSN: 08910138     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (7)