MCM board level optical interconnects using passive polymer waveguides with hybrid optical and electrical multichip module packaging

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 2691, Issue , 1996, Pages 18-24

  Bristow, Julian P ^a   Liu, Yue ^a   Marta, Terry ^a   Johnson, Klein ^a   Hanzal, Brian R ^a   Peczalski, Andrzej ^a   Bounnak, Sommy ^a   Liu, Yung S ^a   Cole, Herbert S ^a  

^a HONEYWELL TECHNOLOGY CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP AND WIRE PACKAGING SCHEMES; HYBRID PACKAGING; PASSIVE POLYMER WAVEGUIDE;

ELECTRONICS PACKAGING; MULTICHIP MODULES; OPTICAL WAVEGUIDES; OPTOELECTRONICS; PLASTICS APPLICATIONS;

OPTICAL INTERCONNECTS;

EID: 0029696232     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)