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Volumn , Issue , 1996, Pages 652-659
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Thermal management of a C4/CBGA interconnect technology for a high-performance RISC microprocessor: the Motorola PowerPC 620 microprocessor
a
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Author keywords
[No Author keywords available]
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Indexed keywords
COMPUTATIONAL FLUID DYNAMICS;
COMPUTER SIMULATION;
ELECTRONICS PACKAGING;
HEAT RESISTANCE;
HEAT SINKS;
HEAT TRANSFER;
INTERCONNECTION NETWORKS;
INTERFACES (MATERIALS);
PRINTED CIRCUIT BOARDS;
REDUCED INSTRUCTION SET COMPUTING;
SEMICONDUCTING SILICON;
SURFACE MOUNT TECHNOLOGY;
CERAMIC BALL GRID ARRAY SUBSTRATE;
DIE JUNCTION TEMPERATURE;
THERMAL MANAGEMENT;
THERMAL MODELS;
THERMAL TEST VEHICLE;
MICROCOMPUTERS;
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EID: 0029695979
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Article |
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Times cited : (3)
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References (19)
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