A knowledge-based thermal profile identification advisor for surface mount PCB assembly

International Journal of Advanced Manufacturing Technology

Volumn 11, Issue 5, 1996, Pages 343-352

  Wu, Chien Hsing ^a   Srihari, K ^a   McLenaghan, A J ^b  

^a BINGHAMTON UNIVERSITY   (United States)

^b UNIVERSAL INSTRUMENTS CORPORATION   (United States)

Author keywords

Expert systems; Infrared reflow soldering; Printed circuit board assembly; Surface mount technology

Indexed keywords

MANUFACTURING PROCESS; REFLOW SOLDERING;

COMPUTER AIDED MANUFACTURING; EXPERT SYSTEMS; SURFACE MOUNT TECHNOLOGY; TEMPERATURE DISTRIBUTION; ASSEMBLY; INFRARED RADIATION; KNOWLEDGE BASED SYSTEMS; OPTIMIZATION; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; PROCESS CONTROL; PROLOG (PROGRAMMING LANGUAGE); SOLDERING; TEMPERATURE CONTROL;

PRINTED CIRCUIT BOARDS; COMPUTER AIDED MANUFACTURING;

INFRARED CONVECTION OVEN; INFRARED REFLOW SOLDERING; PRINTED CIRCUIT BOARD ASSEMBLY; SOLDER PASTE; THERMAL PROFILE IDENTIFICATION;

EID: 0029659076     PISSN: 02683768     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF01845693     Document Type: Article

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