Advanced copper interconnections for silicon CMOS technologies

Applied Surface Science

Volumn 91, Issue 1-4, 1995, Pages 112-123

  Torres, J ^a  

^a ORANGE LABS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; COMPUTER SIMULATION; ELECTRIC WIRING; INTEGRATED CIRCUIT MANUFACTURE; METALLIZING; SEMICONDUCTING SILICON; ULSI CIRCUITS;

COPPER INTERCONNECTS; METALLIZATION;

COPPER;

EID: 0029633279     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/0169-4332(95)00105-0     Document Type: Article

References (29)

1. Interconnection Challenges of the 1990'8
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3. Chemical vapor deposition of copper from 1,5-cyclooctadiene copper(I) hexafluoroacetylacetonate
4. Jpn. Soc. Appl. Phys.
5. Proc. Symp. on VLSI Technol.
6. Proc. VMIC