Modeling latent and patent failures of electronic products

Microelectronics Reliability

Volumn 35, Issue 12, 1995, Pages 1501-1510

  Yan, Li ^a   English, J R ^a   Landers, T L ^a  

^a UNIVERSITY OF ARKANSAS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; DEFECTS; ELECTRONIC EQUIPMENT MANUFACTURE; FAILURE ANALYSIS; MATHEMATICAL MODELS; THERMAL STRESS; WEIBULL DISTRIBUTION;

ELECTRONIC PRODUCTS; ENVIRONMENTAL STRESS SCREENING; FUNCTIONAL TESTING; LATENT DEFECT; PATENT DEFECT; THERMAL STRESS SCREENING;

ELECTRONICS INDUSTRY;

EID: 0029576423     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/0026-2714(94)00158-K     Document Type: Article

References (13)

1. Reliability Enhancement Through Optimal Burn-In
2. Determining Optimum Burn-In and Replacement Times Using Bayesian Decision Theory
3. Cost Effective Burn-In and Replacement Times
4. Optimal policies for burn-in procedures
5. An Investigation of the Burn-In Problem
6. Optimizing spare module burn-in
7. ‘Bad-as-old’ analysis of system failure data
8. Cost-Optimized Burn-In Duration for Repairable Electronic Systems
9. Burn-in optimization under reliability and capacity restrictions
10. The quantification of environmental stress screening
11. ESS quantification of complex systems
12. A 2-Level environmental stress screening (ESS) model: a mixed distribution approach